Nippon Chemi-Con‘s patented capacitor design aims to reduce mounting failures during solder reflow by incorporating a unique structure with a sealed outer case, lead terminal, and convex portion. The gap between the caulking and convex portions allows for flexibility during the mounting process. GlobalData’s report on Nippon Chemi-Con gives a 360-degree view of the company including its patenting strategy. Buy the report here.
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According to GlobalData’s company profile on Nippon Chemi-Con, Hydrogen storage alloys was a key innovation area identified from patents. Nippon Chemi-Con's grant share as of February 2024 was 57%. Grant share is based on the ratio of number of grants to total number of patents.
Capacitor design to reduce mounting failure in solder reflow process
The granted patent (Publication Number: US11908635B2) describes a capacitor design and a method for manufacturing and mounting the capacitor. The capacitor comprises a capacitor element housed in a cylindrical outer case with a sealed open end, a lead terminal derived from the capacitor element through a sealing member, and a pedestal with a convex portion protruding towards the capacitor body. The design includes a gap portion between the convex portion and caulking portions on the outer case, allowing for axial movement of the capacitor body within the pedestal.
Furthermore, the method of manufacturing the capacitor involves sealing the open end of the outer case, deriving a lead terminal from the capacitor element, housing it in a pedestal with a convex portion, and providing a gap portion between caulking portions. The method also includes mounting the capacitor by inserting the lead terminal into a circuit board through a hole filled with solder paste and creating a solder reflow connection. Additionally, the method involves temporarily fixing the lead terminal by bending it after insertion into the hole on the circuit board. These innovations in capacitor design and manufacturing process aim to improve the stability and reliability of capacitors in electronic devices.
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