Ideal Power has filed a patent for a double-sided cooling package designed for double-sided, bi-directional junction transistor chips. The innovative design includes heat sinks with direct plating copper structures and copper contacts for efficient cooling. GlobalData’s report on Ideal Power gives a 360-degree view of the company including its patenting strategy. Buy the report here.
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According to GlobalData’s company profile on Ideal Power, Smart energy mgmt systems was a key innovation area identified from patents. Ideal Power's grant share as of January 2024 was 55%. Grant share is based on the ratio of number of grants to total number of patents.
Cooling package for double-sided chips with dsta sandwiched
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A recently filed patent (Publication Number: US20230386987A1) describes a cooling package designed for double-sided chips, featuring a double-sided, bi-directional junction transistor chip with an individual, double-sided, bi-directional power switch (DSTA) placed between heat sinks. These heat sinks are equipped with direct plating copper (DPC) structures, including opposed first and second copper layers on a substrate, along with copper contacts extending from the second copper layer through vias in each substrate to the exterior of the cooling package. The patent also details variations in the cooling package, such as the inclusion of multiple DSTAs, symmetrical DSTA designs, and asymmetrical temperature soldering techniques.
Furthermore, the patent outlines specific configurations and operational capabilities of the cooling package, including the ability to handle high electrical currents, operate at significant power levels, and accommodate various wafer thicknesses. The cooling package's construction involves precise layer thicknesses for the copper components, specific substrate materials, and thermal resistance characteristics. Additionally, the patent discusses the use of molding compounds or epoxy encapsulation, fine line pitch resolutions, and the stacking of multiple cooling packages to enhance blocking voltage or operation current. The patent also includes methods for soldering the transistor, involving sintering Ag on the pads of the DSTA and aligning heat sinks with these pads, highlighting the importance of direct plating copper (DPC), direct copper bonding (DCB), and direct aluminum bond (DAB) structures in the process.
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GlobalData Patent Analytics tracks bibliographic data, legal events data, point in time patent ownerships, and backward and forward citations from global patenting offices. Textual analysis and official patent classifications are used to group patents into key thematic areas and link them to specific companies across the world’s largest industries.
