Sungrow Power Supply has been granted a patent for a radiator design featuring a heat dissipation substrate with a stress release groove at the mounting position for its heat dissipation assembly. This innovation aims to reduce stress from thermal deformation by creating an island structure at the connection point. GlobalData’s report on Sungrow Power Supply gives a 360-degree view of the company including its patenting strategy. Buy the report here.
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According to GlobalData’s company profile on Sungrow Power Supply, Smart energy mgmt systems was a key innovation area identified from patents. Sungrow Power Supply's grant share as of July 2024 was 63%. Grant share is based on the ratio of number of grants to total number of patents.
Radiator with stress relief for heat dissipation assembly
The granted patent US12069841B2 describes a radiator designed to enhance heat dissipation through a unique structural configuration. The radiator comprises a heat dissipation substrate and a heat dissipation component, with a designated mounting position for the component that features a recessed welding groove. This groove is complemented by a stress relieve groove, which is strategically formed at the mounting position to mitigate stress during the welding process. The claims further elaborate on the design, indicating that multiple stress relieve grooves can be incorporated, potentially arranged in various configurations such as grid or loop shapes, with island structures formed between them to optimize structural integrity.
Additionally, the patent outlines the versatility of the radiator, allowing for multiple mounting positions and corresponding heat dissipation components, which can be arranged sequentially along the mounting position. The design also accommodates the inclusion of heat dissipation fins, positioned on opposite sides of the substrate, to further enhance thermal management. The claims extend to applications in electrical devices, where the radiator is utilized in conjunction with a heat-generating device, underscoring its practical utility in managing heat in electronic systems.
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GlobalData Patent Analytics tracks bibliographic data, legal events data, point in time patent ownerships, and backward and forward citations from global patenting offices. Textual analysis and official patent classifications are used to group patents into key thematic areas and link them to specific companies across the world’s largest industries.
