Today, there is a great market demand for all sorts of advanced power and high-frequency communications electronics, including high-power semiconductors, diodes, converters, amplifiers, radio devices, antennas and some high-frequency ID tags. These devices are widely used across military and aerospace applications as well as various other types of electronics, and optoelectronic devices, and their use is growing rapidly in consumer markets as well.
Fabricating and assembling such devices typically requires the use of adhesives, die-attach compounds, glob top encapsulants, underfills, and/or potting compounds. Since many types of these materials exist, it is essential that engineers be familiar with how the material used can affect design performance.
In this white paper, we will examine the unique requirements power and high-frequency communications electronics place on adhesives and encapsulants, and the characteristics of those materials which allow them to satisfy the designer’s performance objectives.
Download the free white paper for more information.
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